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  • G5 Series
Wire Bonder G5 Single –
Fully automatic wire bonder with a single bond head
A process safe, all-in-one bonder for any demanding wire bonding process, particularly suitable for ball-wedge bonding in packages (deep access)\


  • Deep Access Ball-Wedge
  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon

Wire Bonder G5-2 –
Fully automatic wire bonder with two bond heads
Two different wire bonding processes at the same time on one machine, a space saving and safe process for high speed and high quality applications.\

  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon

Wire Bonder G5-XL –
Fully automatic wire bonder with a large work area
Work area of 1130 mm x 700 mm, ideal for applications in the manufacture of solar modules or battery systems for the E-vehicle market.
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  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon