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  • V55-G

Surface treatment in advanced packaging

• Preventing mold delamination
• Improving yield of wire bonding
• Increasing bonding strengths
• Improving reliability, especially for advanced packages with several hundred I/O´s
Type V6-G V15-G V55-G V80-G
Chamber size 6L 15L 55L 80L
2.45GHz Micro wave 300w 600w 1200w Dual1200w