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  • T-8000-G

T-8000 \

FLEXIBLE AUTOMATIC DIE BONDER


The T-8000 Die Bonder is a fully-automated all-purpose system for R&D, pilot and medium size production. Fully built on granite, equipped with linear motors and 0.1µm resolution glass scales, enable a precision of 2.5µm. A force range of 10g to 5kg, combined with the large working area of 700 x 500mm and wafer handling up to 12”, open a wide range of applications. With numerous available options, the T-8000 can be customized to best suit your needs.
 

FEATURES

Customized substrate holders and fixtures available
Wafer ring or wafer frame holders
Automatic 3-D and force calibration
Flux dipping station
SMD feeder capability (8 and 12mm)
Up looking camera
Dispenser (Time/ Pressure or volumetric)
Stamping unit
Automatic tool changer (optional for heated tools)
Eutectic bonding unit with protective gas chamber