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T-6000L \

FLEXIBLE AUTOMATIC DIE BONDER


The T-6000L Die Bonder is a fully-automated all-purpose system for R&D, pilot and medium size production.
Equipped with linear motors and 0.1µm resolution glass scales, enable a precision of 8µm.
A force range of 20g to 800g (optional 10g to 5kg), combined with the large working area of 495 x 400mm an
d wafer handling up to 8”, open a wide range of applications. With numerous available options,
the T-6000L can be customized to best suit your needs.

 

T-6000-L/G \

Flexible High Precision Automatic Die Bonder

The T-6000-L/G is an enhanced version of the proven T-6000-L series. A fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system. T-6000-L/G can be upgraded with new loader and unloader modules. The throughput for the latest advanced packaging applications has been extremely improved.
With numerous available options, the T-6000-L/G can be customized to suit all market needs. This system offers our customers the opportunity to grow from a manual manufacturing process to a fully automated process without any additional hardware changes. Just a few software clicks will guide you through this process.
 

FEATURES

  • Up looking camera
  • Dispenser (Time/ Pressure or volumetric)
  • Stamping unit
  • Automatic tool changer (optional for heated tools)
  • Eutectic bonding unit with protective gas chamber
  • Customized substrate holders and fixtures available
  • Wafer ring or wafer frame holders
  • Automatic 3-D and force calibration
  • Flux dipping station
  • SMD feeder capability (8 and 12mm)